SikaBond®-5500 S

1 part synthetic resin combination

12 months if stored as outlined, in undamaged original sealed container.

Store in dry conditions, and protect from direct sunlight, at temperatures not lower than +5 or higher than +25 °C

1.53 - 1.58 kg/l

up to 35 °C

Consistency: Spreads easily, trowel marks stable.

Room temperature above +10 °C, ideally +15 °C. Relative air humidity < 75 %.

For ambient temperatures the standard construction rules are relevant.

Between 40% and 75%

During laying and until SikaBond®-5500 S has fully cured substrate temperature must be > + 10 °C and in the case of underfloor heating < + 20 °C.

For substrate temperatures the standard construction rules are relevant

Maximum substrate moisture content :

• 2.5 % CM (carbide meter) for cement screed (ca. 4 % Tramex / Gravimetric weight percent)
• 0.5 % CM for anhydrite screed
• 3 - 12 % CM for magnesia flooring (proportion of organic parts)

Maximum substrate moisture content in case of underfloor heating:

• 1.8 % CM for cement screed (ca. 3 % Tramex / Gravimetric weight percent)
• 0.3 % CM for anhydrite screed
• 3 - 12 % CM for magnesia flooring (proportion of organic parts)

For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed.

Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex).

Floor may be walked on / sanded and finished approximately 48 - 72 hours after installation (depending on climatic conditions, absorbency of subfloor and adhesive layer thickness).

~ 10 - 20 minutes (+23 °C / 50 % r.h.)

For full surface bonding only. Ensure that the contact faces of the wood elements are fully wetted with adhesive. 0.95 – 1.25 kg/m² depending upon size of notched trowel used and subfloor surface profile.

For the bonding of long or wide boards or in case of uneven substrates it could be necessary to use a notched trowel with bigger notches (avoid hollow sections).

Substrate Quality:  Clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, cement laitance and other poorly adhering particles must be removed. Standard construction rules must be observed.

Substrate Preparation:

Concrete / cement screed: Must be clean, dry, contaminant free and thoroughly cleaned with industrial vacuum cleaner.

Anhydrite screed / Anhydrite flowable screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner.

Underfloor Heating: After thorough preparation and commissioning of the heating system, substrates with high moisture content should be primed using a mixture of 1 part SikaBond®-5500 S to 1 part Adhesive Thinner and Cleaner (by volume). Roller apply and allow to cure.

Unknown substrates: Please contact our Technical Department.

SikaBond®-5500 S can be used without priming on cement floors, poured asphalt and wooden floor panels providing they are dust free and permanently dry.

Mastic ashphalt should be sanded and vacuumed.

Clean all tools and application equipment with Adhesive Thinner and Cleaner immediately after use. Hardened / cured material can only be mechanically removed.