Product Data Sheet Show all documents
SikaBond®-52 Wood Floor

SikaBond®-52 Wood Floor

Solvent-free elastic adhesive for Wood Flooring

SikaBond®-52 Wood Floor is a fast-curing elastic wood flooring adhesive for professional use. Ideal for bonding wood floors using liquid batten/beaded application. Use with solid, engineered, parquet wood floors and chipboard.

  • 1-component, ready to use.
  • Fast curing properties.
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness).
  • Excellent workability, very easy to extrude.
  • Good initial tack.
  • Elastic, footfall sound-dampening adhesive.
  • Suitable for most common types of wood floors.
  • Especially suitable for problematic woods including beech, maple and bamboo.
  • Suitable for bonding wood floors directly onto old ceramic tiles.
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate.
  • Suitable for use with subfloor heating.
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded.
  • Solvent free.
  • Odourless.
Product Data Sheet Show all documents

Usage

For Full Surface bonding: Solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, lam parquet, wood paving (residential) as well as chipboard, plywood and OSB can be bonded. For the Sika® AcouBond®-System: Solid wood boards (tongued and grooved), 3-ply engineered wood, chipboard, plywood and herringbone blocks can all be bonded. For detailed application instructions refer to the Product Data Sheet of the Sika® AcouBond®-System, or contact our Technical Department. For Beaded Application: Solid wood boards, 3-ply engineered wood and chipboard can be bonded.  

Advantages

  • 1-component, ready to use.
  • Fast curing properties.
  • Floor can be sanded after 12 hours (full surface bonding, +23°C / 50% r. h., up to 1 mm adhesive thickness).
  • Excellent workability, very easy to extrude.
  • Good initial tack.
  • Elastic, footfall sound-dampening adhesive.
  • Suitable for most common types of wood floors.
  • Especially suitable for problematic woods including beech, maple and bamboo.
  • Suitable for bonding wood floors directly onto old ceramic tiles.
  • Reduces stress to the substrate: the elastic adhesive reduces stress transfer between the wood floor and the substrate.
  • Suitable for use with subfloor heating.
  • Compensates for some substrate unevenness.
  • Adhesive can be sanded.
  • Solvent free.
  • Odourless.

Packaging

600ml Foil

Colour

Parquet brown

Product Details

Sustainability / Certifications / Approvals

APPROVALS / STANDARDS

EMICODE EC 1PLUSR, very low emission
Product Information

Chemical Base

1-part Polyurethane, moisture curing

Shelf Life

12 months from date of production

Storage Conditions

Store in undamaged, original sealed containers, in dry conditions and protected from direct sunlight at temperatures between +10°C and +25°C.

Density

~ 1.29 kg/l
Technical Information

Shore A Hardness

~ 34 (after 28 days)

Tensile Strength

~ 1.4 N/mm2, (+23°C / 50% r. h.)

Shear Strength

~ 1.1 N/mm2 , 1 mm adhesive thickness (+23°C / 50% r. h.)

Service Temperature

-40°C to +70°C

Application

Application Information

Sag Flow

Consistency: Spreads easily, trowel marks stable. Easily applied by guns.

Ambient Air Temperature

Ambient temperature between +15°C and +35°C. For ambient temperatures the standard construction rules are relevant.

Relative Air Humidity

Between 40% and 70%.

Substrate Temperature

During laying and until SikaBond®-52 Wood Floor has fully cured the substrate and ambient temperatures should be > +15°C and with floor heating approx. < +20°C. For substrate temperatures the standard construction rules are relevant.

Substrate Moisture Content

Permissible substrate moisture content:

  • 2.5% CM for cement screed (ca. 4% Tramex / Gravimetric weight percent).
  • 0.5% CM for anhydrite screed.
  • 3 - 12% CM for magnesite flooring (dependent on proportion of organic components).

Permissible substrate moisture content for use with underfloor heating:

  • 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent).
  • 0.3% CM for anhydrite screed.
  • 3 - 12% CM for magnesite flooring (dependent on the proportion of organic components).

For moisture contents and the quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed.

Curing Rate

~ 3.5 mm / 24h (+23°C / 50% r. h.)

The floor may be walked on / sanded 12 hours to 24 hours after installation ( +23°C / 50% r. h. up to 1 mm adhesive thickness dependent on climatic conditions and adhesive layer thickness).

Skin Time / Laying Time

~ 60 minutes (+23°C / 50% r. h.)

 
Consumption

Consumption

Sika® AcouBond®-System:

610 (03) - 770 (05) g/m2 (480 - 600 ml/m2 ). Filling of all cut-outs is a must. Use pre-cut triangular nozzle with 8 x 10 mm opening.

Full Surface Bonding:

  • 600 - 700 g/m2 with notched trowel B3 (acc. to IVK guidelines) (e. g. lam parquet, mosaic parquet and industrial parquet).
  • 600 - 700 g/m2 with notched trowel B6 (= P4) (acc. to IVK guidelines) or 3/16" 1/8" 1/8" (engineered strips / planks, mosaic parquet, etc).
  • 600 - 900 g/m2 with notched trowel B11 (= P6) (acc. to IVK guidelines), AP 48 or 3/16" 3/16" 3/16" (solid wood, engineered planks / panels, industrial parquet, wood paving (residential), chipboards etc).
  • For bonding of long or wide boards or on uneven substrates it may be necessary to use a notched trowel with bigger notches (to prevent hollow sections).

Beaded Application:

~ 44 ml per running metre = 250 - 500 g/m2 , dependent on bead spacing (solid wood boards;maximum width 150mm, 3-ply engineered wood, chipboard or plywood).

For substrates primed with Sika® Primer MB / SikaBond® Rapid DPM, the consumption of SikaBond®-52 Wood Floor is reduced.
Application steps

SUBSTRATE PREPARATION

Concrete / cement screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner.

Anhydrite screed / Anhydrite flowable screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner shortly before bonding starts.

Broadcast mastic asphalt: Must be primed with Sika® Primer MB / SikaBond® Rapid DPM. Please refer to the respective Product Data Sheet.

Glazed ceramic and old ceramic tiles: Degrease, clean with Sika® Aktivator-205 or grind the tile surfaces and vacuum thoroughly.

Wood / gypsum boards (e.g. chipboards, plywood): Glue / screw the boards to the substructure. They must be fixed to the substrate. For floating subfloors, please contact our Technical Department.

Other substrates: please contact our Technical Department for advice and assistance.

SikaBond®-52 Wood Floor can be used without priming on cementitious floors, anhydrite floors, chipboards, concrete and ceramic tiles.

For broadcast mastic asphalt, cementitious floors with an excessive moisture content and for use over old adhesive residues or on weak substrates use Sika® Primer MB / SikaBond® Rapid DPM. For detailed instructions refer to the respective Product Data Sheet or contact our Technical Department.

CLEANING OF TOOLS

Clean all tools and application equipment with Sika® Remover-208 or Everbuild Multi-Use Wonder Wipes immediately after use. Hardened / cured material can only be removed mechanically.

 

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