SikaBond®-54 Parquet

• VOC emission classification GEV-Emicode EC1^PLUS, license number 3143/01.01.21
• LEED v4 EQc 2: Low-Emitting Materials

i-Cure® technology polyurethane

SikaBond®-54 Parquet has a shelf life of 12 months from the date of production, if it is stored properly in undamaged, original, sealed packaging, and if the storage conditions are met.

SikaBond®-54 Parquet shall be stored in dry conditions, protected from direct sunlight and at temperatures between +5 °C and +25 °C.

+5 °C min. / +40 °C max.

Spreads very easily whilst maintaining stable trowel peaks.

+15 °C min. / +35 °C max.

40 % min. / 70 % max.

During laying and until SikaBond®-54 Parquet has fully cured, the substrate and ambient temperatures shall be between +15 °C and +35 °C without and between +20 °C and +35 °C with underfloor heating

~4.0 mm/24 hours (23 °C / 50 % r.h.)

~60 minutes (23 °C / 50 % r.h.)

Note: When bonding long or wide boards or applying on uneven substrates, a sufficient amount of adhesive must be applied to provide full surface bonding.

Note: Substrates primed with Sika® Primer MB, may reduce the consumption.

These figures are theoretical and do not allow for any additional material due to surface porosity, surface profile, variations in level, wastage or any other variations. Apply product to a test area to calculate the exact consumption for the specific substrate conditions and proposed application equipment.

For the application of SikaBond®-54 Parquet all generally accepted rules for wood flooring installation apply.
For further information, please refer to the Method Statement "Full Surface Bonding".

Note: Adhesion tests on project specific substrates must be performed and procedures agreed with all parties before full project application. For more detailed advice and instructions contact Sika Technical Services.

• The substrate must be clean, dry, sound and free from oils, grease, dust, cement laitance and loose or friable particles.
• Use wire brushing, abrading, grinding or grit blasting equipment to prepare the substrate.

Completely remove all dust, loose and friable material from all surfaces before application of any activators, primers or adhesive preferably by industrial vacuuming equipment.

Concrete / cementitious screeds

Grind flat the substrate to provide a smooth surface without any surface irregularities.

Fill any voids or cavities with appropriate Sika® compatible flooring repair or levelling products.

Calcium sulphate (Anhydrite) screeds

Grind flat the substrate to provide a smooth surface without any surface irregularities.

Fill any voids or cavities with appropriate Sika® compatible flooring repair or levelling products.

Mastic asphalt

Prime with Sika® Primer MB and broadcast with quartz sand. Refer to individual Product Data Sheets.

Glazed or unglazed ceramic tiles

Degrease and clean with Sika® Aktivator-205. Alternatively grind glazed surfaces to remove the glaze.

Wood

Note: Wood types such as chipboards (V100), OSB or plywood as well as gypsum boards must be securely fixed to the substructure.

Note: For floating dry floors, contact Sika Technical Services for additional information.

Remove any surface irregularities using abrading equipment.

Other substrate types

Contact Sika Technical Services.

Priming

The Product can be used without priming on concrete / cementitious/ anhydrite screeds, chipboards, concrete and ceramic tiles.

Use  Sika® Primer MB for broadcasted mastic asphalt, concrete / cementitious subfloors or screeds with excessive moisture content, old adhesive residue or weak substrates. Refer to individual Product Data Sheet or contact Sika Technical Services for additional information.

Before wood floors can be installed in non-insulated areas, such as basements or other areas without a damp proof membrane, Sikafloor®EpoCem must be applied and sealed with Sika®Primer MB to control the moisture. Contact Sika Technical Services for additional information.

Clean all tools and application equipment immediately after use with Sika® Remover-208. Once cured, residual material can only be removed mechanically.