SikaBond® MS Wood Floor

1-part STPE (Hybrid technology, moisture curing)

9 months from date of production if stored in undamaged and unopened, original sealed containers.

Keep in dry conditions and protected from direct sunlight at temperatures between +10°C and +25°C.

1.6-1.7 kg/l

>1.0 N/mm² after 1 day and >2.0 N/mm² after 1 week

-40°C to +80°C

Consistency: spreads easily, trowel marks stable

Ambient temperature shall be between +15°C and +35°C.

Between 40% and 70%

During laying and until SikaBond® MS Wood Floor has fully cured the substrate and ambient temperatures must be > +15°C and when used with under floor heating ~+20°C.

Permissible substrate moisture content :
- 2.5% Carbide Method (CM) for cement screed (ca. 4% Tramex / Gravimetric weight percent)
- 0.5% CM for anhydrite screed
- 3 - 12% CM for magnesite flooring (dependent on the proportion of organic
material)
Permissible substrate moisture content for use with under floor heating:
- 1.8% CM for cement screed (ca. 3% Tramex / Gravimetric weight percent)
- 0.3% CM for anhydrite screed
- 3 - 12% CM for magnesite flooring (depending on the proportion of organic material).

1.0-2.0 mm / 24h (+23°C / 50% r. h.)  The floor can be walked on / sanded 12 hrs to 24 hours after installation

~ 40 minutes (+23°C / 50% r. h.)

Minimum 0.6kg/m² with a suitable notched trowel

Note: For substrates primed with Sika® Primer MB or SikaBond^® Rapid DPM the consumption of SikaBond® MS Wood Floor is reduced.

Substrate Quality

Clean and dry, homogeneous, even, free from oils and grease, dirt and loose or friable particles. Paint and cement laitance must be removed.

Substrate Preparation

Concrete / cement screed:
- Must be ground, thoroughly cleaned and vacuumed.

Anhydrite screed / flowable anhydrite screed:
- Must be ground and thoroughly cleaned and vacuumed shortly before bonding starts.
Broadcast mastic asphalt:
- Must be primed with Sika® Primer MB or SikaBond® Rapid DPM. Please refer to the respective Product Data Sheet.
Glazed ceramic and old ceramic tiles:
- Degrease, clean with Sika® Cleaner 208 or grind the tile surface and vacuum thoroughly.
Wood / gypsum boards (e.g. chipboards, plywood, plasterboard etc):
- Glue / screw the boards to the substructure. They must be firmly and securely fixed to the substrate. For floating sub floors, please contact our Technical Service Department for assistance.
Other substrates:
- Please contact our Technical Service Department for advice and assistance.
- SikaBond® MS Wood Floor can be used without priming on cementitious floors, anhydrite floors, chipboard, concrete and ceramic tiles.
- For broadcast mastic asphalt, cementitious floors with excessive moisture content and for use over old adhesive residues or on weak substrates use Sika® Primer MB or SikaBond Rapid DPM. For detailed instructions refer to the respective Product Data Sheet or contact our Technical Service Department.

Clean all tools and application equipment with Sika® Cleaner-208 immediately after use. Hardened/cured material must be removed mechanically.