SikaBond® MS Wood Floor Gun Grade

SikaBond® MS Wood Floor Gun Grade

High quality, gun-applied wood flooring adhesive

SikaBond® MS Wood Floor Gun Grade is a high quality, gun-applied MS adhesive for bonding wooden floors to all common substrates. Being permanently elastic it accommodates differential movement caused by changes in humidity and climatic conditions. When used as part of the Sika® AcouBond® system, it is ideal for use with underfloor heating systems.

  • Water free – will not cause warpage or curl of wood blocks/planks.
  • Permanently flexible – compensates for subfloor movement.
  • Suitable for use with underfloor heating (due to high flexibility).
  • Odourless.
  • Excellent gap filling properties for uneven surfaces.
  • Bonds to all common subfloor materials

Usage

Bonds directly to all common subfloor materials:
  • Concrete
  • Anhydrite
  • Chipboard
  • Plywood
  • Metal
  • Ceramic tiles
  • Most natural stone floors.
Note: for other substrates call Sika Technical Services.  

Advantages

  • Water free – will not cause warpage or curl of wood blocks/planks.
  • Permanently flexible – compensates for subfloor movement.
  • Suitable for use with underfloor heating (due to high flexibility).
  • Odourless.
  • Excellent gap filling properties for uneven surfaces.
  • Bonds to all common subfloor materials

Packaging

600 ml foils

Colour

Parquet Brown

Product Details

Product Information

Shelf Life

12 months from date of manufacture when stored as directed

Storage Conditions

Store upright in original, tightly sealed container, and in a dry, cool and well ventilated area between +5°C and +25°C, protected from sunlight and frost.

Density

1.5 - 1.6 g/cm3 at 20°C

Application

Application Information

Curing Time

Complete cure after 36-48 hours depending on porosity or substrates and ambient conditions
Consumption

Consumption

2 m2 per 600 ml foil pack
Application steps

SUBSTRATE PREPARATION

All surfaces must be sound, clean, dry and free from dust, grease or other contaminants that can affect adhesion. Existing floors must be free from all polish/wax/silicone/sealers etc.

For cement based substrates with a moisture content >2 % CM (Carbide Method) but < 4 % CM, apply SikaBond® Primer-MB or SikaBond® Rapid DPM as a liquid damp proofing membrane. N.B Never apply damp proof membranes on top of a wet anhydrite screed.

Always check moisture content of subfloor and record readings. If in doubt please consult a specialist. Where moisture levels are above those recommended by the flooring manufacturer but below 4 % CM (6 % Tramex), prime with SikaBond® Primer-MB or SikaBond® Rapid DPM.

Basement/below ground floors: ensure climatic conditions are appropriate for the installation of wood flooring. Flooring substrate must be adequately protected from moisture ingress under hydrostatic pressure. Where a vapour barrier is required apply two coats of SikaBond® Primer-MB or SikaBond® Rapid DPM.

All underfloor heating systems should be fully commissioned prior to installation of any floor finishes.

Turn off any underfloor heating systems 24 hours before, and until 24 hours after, applying the adhesive.

Flooring should be acclimatised for several days in the room where it is to be installed.

CLEANING OF TOOLS

Fresh, uncured adhesive remaining on the wood surface must be removed immediately and if necessary cleaned with Sika® Remover-208. Test wood floor surfaces for compatibility with Sika® Remover-208 before use. Cured adhesive may be removed from prefinished flooring using a suitable plastic scraper and/or pencil eraser.