Product Data Sheet Safety Data Sheet Show all documents
SikaBond® Rapid DPM

SikaBond® Rapid DPM

Solvent Free Resin Primer and Damp Proof Membrane for Cement Based Substrates

SikaBond® Rapid DPM is a single part moisture curing polyurethane.

  • 1-part, ready to use.
  • Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
  • Compatible with all SikaBond® wood floor adhesives.
  • Especially suited to refurbishment projects where old adhesive residues are present.
  • Suitable for underfloor heating.
  • Applied by roller or squeegee.
Skinning / Laying Time ~10-20 minutes (+20 °C  50 % r.h.) Sag Flow Consistency:
Spreads easily when applied using brush, squeegee or short/medium pile roller
Product Data Sheet Safety Data Sheet Show all documents

Usage

For priming, consolidating and sealing of:
  • Absorbent and non-absorbent sub-floors, consolidating weak cement screed and isolation of old adhesive residues.
  • Can be used as a Damp Proof Membrane on sub-floors not under hydrostatic pressure.
  • Can be used over underfloor heating. (Max 3 % moisture CM Method, 4.5 % Tramex).
 

Advantages

  • 1-part, ready to use.
  • Rapid drying (approx 45 minutes at 50 % r.h. & 20 °C).
  • Compatible with all SikaBond® wood floor adhesives.
  • Especially suited to refurbishment projects where old adhesive residues are present.
  • Suitable for underfloor heating.
  • Applied by roller or squeegee.
Skinning / Laying Time ~10-20 minutes (+20 °C  50 % r.h.) Sag Flow Consistency:
Spreads easily when applied using brush, squeegee or short/medium pile roller

Packaging

5 L Jerry can.

Colour

Brown.

Product Details

Product Information

Chemical Base

1-part reaction cure synthetic resin.

Shelf Life

Up to 12 months from date of manufacture when stored as directed.

Storage Conditions

Store in tightly closed undamaged original sealed containers, in dry conditions and protected from direct sunlight at temperatures between +5 °C and +25 °C. 

Density

1.16 g/cm³

Flash Point

Closed cup >130 °C, Open cup >150 °C
Technical Information

Service Temperature

Up to + 35 °C

 

Application

Application Information

Ambient Air Temperature

Room temperature above +10 °C. Relative air humidity < 75 %.
For ambient temperatures the standard construction rules are relevant.

Relative Air Humidity

Between 40 % and 75 %.

Substrate Temperature

During laying and until SikaBond® Rapid DPM has fully cured substrate temperature must be at least + 10 °C and in the case of underfloor heating < + 20 °C. For substrate temperatures the standard construction rules are relevant.

Substrate Moisture Content

Maximum substrate moisture content :

  • 4 % CM for cement screed (ca. 6 % Tramex / Gravimetric weight percent).
  • 0.5 % CM for anhydrite screed.
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts).

Maximum substrate moisture content in case of underfloor heating:

  • 3 % CM for cement screed (ca. 4.5 % Tramex / Gravimetric weight percent).
  • 0.3 % CM for anhydrite screed.
  • 3 - 12 % CM for magnesia flooring (proportion of organic parts).

For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be observed. Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex).

Curing Time

Approximately 45 minutes at 20 °C & 50 % r.h.
Consumption

Consumption

As a surface conditioner/primer:
Apply 1 coat at a minimum consumption of 100 – 200 g/m² (85-170 ml/m²).
As an isolator for old adhesive residues:
Apply 1 coat at a minimum consumption of 100 – 200 g/m² (85-170 ml/m²).
As a Damp Proof Membrane: (tested in accordance with ASTM E 96)
Apply 2 – 3 coats at 100 – 250 g/m² (85-215 ml/m²). Allow each coat to fully cure. Total consumption should be no less than 400 g/m² (340 ml/m²).
Application steps

SUBSTRATE PREPARATION

Substrate quality: Clean, homogeneous, even, free from grease, dust and loose particles. Paint, cement laitance and other poorly adhering particles must be removed. Maximum moisture content must not exceed 4 % CM method (6 % Tramex) 3 % CM (4.5 % Tramex) in the case of underfloor heating. Standard construction rules must be observed.

Preparation:

  • Concrete / cement screed: Must be clean, contaminant free and thoroughly cleaned with industrial vacuum cleaner.
  • Anhydrite screed / Anhydrite flowable screed: Must be ground and thoroughly cleaned with industrial vacuum.
  • Unknown substrates: Tests are recommended for compatibility and adhesion.

CLEANING OF TOOLS

Clean all tools and application equipment with Thinner C immediately after use. Hardened / cured material can only be mechanically removed.

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