Sikafloor®-201 FiberLevel

• Contributes towards satisfying Materials and Resources (MR) Credit: Building Product Disclosure and Optimization — Material Ingredients under LEED® v4 — 1 point

• Contributes towards satisfying Materials and Resources (MR) Credit: Building product disclosure and optimization — Environmental Product Declarations under LEED® v4 — 1 point

• VOC emission classification GEV Emicode EC1^plus

• Environmental Product Declaration (EPD) in accordance with EN 15804. EPD independently verified by Institut für Bauen und Umwelt e.V. (IBU)

• CE marking and declaration of performance based on EN 13813:2002 Screed material and floor screeds — Screed material — Properties and requirements — Cementitious screed material

Cement-based, polymer-modified and fibre-reinforced

12 months from date of production

The Product must be stored in original, unopened and undamaged packaging in dry conditions at temperatures between +5 °C and +35 °C. Always refer to the packaging.

Refer to the current Safety Data Sheet for information on safe handling and storage.

EN 13813: Class CT-C25-F6

< 75 %

Suitable substrates:

• Concrete
• Cement and rapid cement screeds
• Calcium sulphate-bonded screeds (gypsum)
• Ceramic tiles and natural stone
• Chipboards and OSB
• Substrates with old water-resistant adhesives
• Subfloor heating systems

Before applying a floor covering, make sure the Product has achieved the moisture content value required by the covering manufacturer. Refer to the manufacturer's Product Data Sheet for the respective covering.

The Product can be covered as follows:

Times measured at an ambient temperature of +20 °C, a substrate temperature of +15 °C with a 65 % relative humidity.

Note: Times are approximate and will be affected by changing ambient conditions, particularly temperature and relative humidity. Times are also dependant on layer thickness.

Foot traffic: 4 hours

Note: Times are approximate and will be affected by changing ambient conditions, particularly temperature and relative humidity. Times are also dependant on layer thickness.

1.8 kg/m² per mm thickness

Select the most appropriate equipment for the project.

SUBSTRATE PREPARATION EQUIPMENT

• Abrasive blast cleaning equipment
• Grinding equipment
• Planing machine
• Scarifying machine
• Abrading (sanding) equipment
• Industrial vacuuming equipment

For other types of preparation equipment, contact Sika Technical Services.

MIXING EQUIPMENT

• Electric single-paddle or double-paddle mixer (< 600 rpm) with helical, disc-shaped mixing paddle
• Scraper
• Clean mixing containers

For other types of mixing equipment, contact Sika Technical Services.

APPLICATION EQUIPMENT

• Mixed material carrier
• Pin leveller (pin rake)
• Surface blade
• Screed rake
• Notched trowel
• Smoothing trowels
• Spiked roller

For types of pumping equipment, contact Sika Technical Services.

Cementitious substrates must be sound.

Substrates must be clean, dry and free of all contaminants such as dirt, oil, grease, polish, coatings, water-soluble and water-resistant adhesives, varnish, laitance, surface treatments and loose friable material.

If using the Product on substrates with high movement capacity, the flexibility of the tile adhesive must be higher than the movement of the substrate.

IMPORTANT: Impaired Product properties due to substrates with rising moisture

1. Do not apply the Product on substrates with rising moisture.
2. If rising moisture can occur, apply an effective damp-proof membrane that complies with the applicable national standard.

IMPORTANT: Surface defects due to voids in the substrate

Voids and blow holes in the substrate will weaken the surface and damage the covering Product if not repaired during the preparation process.

1. Fully expose blow holes and voids during surface preparation to identify the required repairs.

CONCRETE, CEMENTITIOUS AND CALCIUM SULPHATE SCREEDS

1. The final texture of the substrate must be open-textured and gripping. Remove weak cementitious and levelling layers, and fully expose defects such as blow holes and voids. Note: Suitable methods for surface preparation are abrasive blast cleaning, grinding, planing or scarifying equipment, depending on the type of substrate.
2. Remove all dust, loose and friable material from the application surface with industrial vacuuming equipment.
3. Repair and fill blow holes and voids using appropriate products from the Sikafloor®, Sikadur® and Sikagard® range of materials.
4. Any repair materials must be cured before starting to apply the Product.
5. Prime the substrate. Select the primer as indicated in further priming instructions.

NATURAL STONE AND CERAMIC

1. Repair or relay broken or loose tiles and stones.
2. The final texture of the substrate must be rough-textured and gripping. Abrade the substrate using sanding equipment.
3. Level the surface or fill cracks, blow holes and voids with products from the Sikafloor®, Sikadur® and Sikagard® range of materials.
4. Remove all dust, loose and friable material from the application surface with industrial vacuuming equipment.
5. Prime the substrate. Select the primer as indicated in further priming instructions.

OSB AND CHIPBOARD

1. Confirm that wood substrates are firmly fixed and do not move.
2. The final texture of the substrate must be rough-textured and gripping. Abrade the substrate using sanding equipment.
3. Fill joints, cracks or holes with wood filler to prevent leakage of the applied Product.
4. Remove all dust, loose and friable material from the application surface with industrial vacuuming equipment.
5. Any repair materials must be cured before starting to apply the Product.
6. Prime the substrate with Sikafloor®-03 Primer undiluted or Sikafloor®-01 Primer undiluted.

OLD WATER-SOLUBLE ADHESIVES

1. Prime the substrate with Sika® Primer MB Rapid, or Sikafloor®-150 Plus, Sikafloor®-151.
2. Fully broadcast the primer with kiln-dried quartz sand.
3. If the primer is not fully broadcast, apply Sikafloor®-02 Primer before applying the Product.

OLD WATER-RESISTANT ADHESIVES

1. Remove old water-resistant adhesives mechanically as thoroughly as possible.
2. Remove all dust, loose and friable material from the application surface with industrial vacuuming equipment.

SUBFLOOR HEATING SYSTEMS

1. Consult the manufacturer for further advice.

PRIMING NORMALLY-ABSORBENT SUBSTRATES SUCH AS CONCRETE, CEMENT SCREEDS, RAPID CEMENT SCREEDS

1. Prime the substrate with Sikafloor®-01 Primer diluted 1 : 3 with water.

PRIMING CALCIUM SULPHATE SUBSTRATES WITH PLANNED PRODUCT LAYER THICKNESS OF LESS THAN 10 MM

1. Prime the substrate with Sikafloor®-03 Primer undiluted or Sikafloor®-01 Primer diluted 1:1 with water.

PRIMING CALCIUM SULPHATE SUBSTRATES WITH PLANNED PRODUCT LAYER THICKNESS OF MORE THAN 10 MM

1. Prime the substrate twice with Sikafloor®-151.
2. Fully broadcast the primer with quartz sand (0.3–0.8 mm).
3. If the primer is not fully broadcast, apply Sikafloor®-02 Primer before applying the Product.

PRIMING NON-ABSORBENT SUBSTRATES SUCH AS CERAMIC TILES, WATER-RESISTANT ADHESIVE RESIDUES AND EPOXY RESIN LAYERS

1. Prime the substrate with Sikafloor®-02 Primer undiluted or Sikafloor®-01 Primer undiluted.

PRIMING MAGNESIA SCREEDS (NOT XYLOLITE)

1. Prime the substrate with Sikafloor®-02 Primer undiluted.

IMPORTANT: Incompatibility with Portland cement

The Product is a special cement binder-based mortar which can expand in contact with standard Portland cements before it has fully cured.

1. Do not mix or blend the Product with Portland cements or other binders.

IMPORTANT: Reduced Product performance due to overaddition of water

1. Do not add more than the prescribed water amount to the Product.
2. Pour the minimum amount of water into a suitable clean mixing container.
3. Use an electric single-paddle or double-paddle mixer (< 600 rpm) with a helical, disc-shaped mixing paddle. Mix the water slowly while gradually adding the complete bag of the Product.
4. Mix continuously for 2 minutes to achieve a smooth, uniform mix. If necessary, add more water to achieve the required consistency.
5. Allow to stand for 2 minutes to allow entrained air to escape and for the mixture to mature.
6. Mix for a further 30 sec.

IMPORTANT: Subfloor cracking due to incorrect assessment of site requirements

1. Bring edge and movement joints through to the finished surface and protect them so the Product will not flow into the joint.
2. Use an isolating strip to prevent the Product bonding onto vertical surfaces, such as pipes, ducts, conduits, walls and columns.
3. Protect the freshly-applied Product from high ambient temperatures, direct sunlight and draughts.

Subfloor thickness and flatness

Note: The Product must be applied to the required thickness and surface flatness as specified by the floor covering manufacturer.

APPLYING A SINGLE LAYER

1. Pour the mixed Product onto the substrate.
2. Spread the Product evenly using a smoothing trowel, surface blade, screed rake or pin leveller (pin rake) to the required thickness.
3. Allow the Product to smooth over the substrate.
4. Immediately use a spiked roller to remove any trowel marks or surface defects, as required. Note: This step is more likely if a trowel was used for spreading, rather than a pin leveller.

APPLYING TWO LAYERS

1. Pour the mixed Product onto the substrate.
2. Spread the Product evenly using a smoothing trowel, surface blade, screed rake or pin leveller (pin rake) to the required thickness.
3. Allow the Product to smooth over the substrate.
4. Immediately use a spiked roller to remove any trowel marks or surface defects, as required. Note: This step is more likely if a trowel was used for spreading, rather than a pin leveller.
5. Allow the first layer to harden.
6. Prime the first layer with Sikafloor®-01 Primer diluted 1:1 with water.
7. In a two-layer application, the thickness of the second layer must not exceed the thickness of the first layer. Apply a second layer of the Product.

Clean all tools and application equipment with water immediately after use. Hardened material can only be removed mechanically.